Product Overview
Technical Summary
| Parameter | Value |
|---|---|
| Product type | SIPLUS ET 200SP BU20-P12+A4+0B BaseUnit, BU type B0 |
| BaseUnit reference | Based on 6ES7193-6BP20-0BB0 |
| Terminal type | Push-in terminal |
| Process terminals | 12 to I/O module; Pro slot |
| AUX terminals | 4; bridged to the left |
| Bus supply voltage | 24 V for P1 and P2 bus; 24 V for AUX bus |
| Process terminal supply voltage | 24 V or 230 V |
| Current carrying capacity | 10 A maximum for P1 and P2 bus and AUX bus up to 60 °C; 5 A maximum for process terminals |
| Potential separation | Between backplane bus and supply voltage; between process terminals 1 to 8 and supply voltage |
Key Features
- BaseUnit type: BU type B0, based on 6ES7193-6BP20-0BB0.
- Terminals: Push-in terminals with 12 process terminals to the I/O module; 4 AUX terminals are bridged to the left.
- Supply voltage: 24 V for the P1 and P2 bus, AUX bus, and process terminals; 230 V is also supplied for these connections.
- Current carrying capacity: Maximum 10 A for the P1 and P2 bus and AUX bus up to 60 °C; maximum 5 A for process terminals.
- Installation temperature: Horizontal installation: -40 °C to 70 °C. Vertical installation: -40 °C to 50 °C.
- Conformal coating: Conformal coating, Class 2 for high reliability, with Type 1 protection against fouling.
Frequently Asked Questions
1. What is the terminal type of the Siemens 6AG1193-6BP20-7BB0?
It has push-in terminals.
2. How many process terminals does this BaseUnit have?
It has 12 process terminals to the I/O module; the terminals are for the Pro slot.
3. What supply voltages are supported?
The source lists 24 V and 230 V for the P1 and P2 bus, AUX bus, and process terminals.
4. What are the installation temperature limits?
For horizontal installation, the range is -40 °C to 70 °C. For vertical installation, it is -40 °C to 50 °C.
5. Are the system-integrated shield connection and add-on terminals included?
The system-integrated shield connection is optional, and the number of add-on terminals is 0.
