Product Overview
Technical Summary
| Parameter | Value |
|---|---|
| Product type | Active Backplane ST 1+8 Slot |
| Number of slots | 9 |
| Backplane bus power consumption | 2 W |
| Slot grid size | 35 mm; utilization of 25 mm-wide modules possible |
| Firmware version | from V1.0.0 |
Applications
- S7-1500 I/O module hot swapping: Used for inserting S7-1500 I/O modules and hot swapping in the ET 200MP with IM 155-5 PN HF from FW V4.4.1.
Key Features
- Active backplane type: Active Backplane ST 1+8 Slot with 9 slots.
- Module insertion and hot swapping: For inserting S7-1500 I/O modules; supports hot swapping.
- Backplane bus power consumption: Power consumption from the backplane bus: 2 W.
- Slot grid size: Grid size: 35 mm; utilization of 25 mm-wide modules is possible.
- Firmware and engineering: Firmware version from V1.0.0; FW update possible. STEP 7 TIA Portal configurable/integrated from V16 / V17.
- Dimensions and weight: 294 mm wide, 99 mm high, 14 mm deep; weight approximately 246 g.
Frequently Asked Questions
1. What is the function of Siemens 6ES7590-0BH00-0AA0?
It is an Active Backplane ST 1+8 Slot for inserting S7-1500 I/O modules and hot swapping.
2. How many slots does the active backplane have?
It has 9 slots.
3. What is the power consumption from the backplane bus?
Power consumption from the backplane bus is 2 W.
4. What is the slot grid size?
The grid size is 35 mm; utilization of 25 mm-wide modules is possible.
